Application of Contactless Testing to PCBs with BGAs and Open Sockets

摘要

This paper introduces a practical test method that combines statistics with the contactless test approach. Experiments using real conventional PCBAs have shown the effectiveness of the method, where significant z-scores are obtained to discriminate defective interconnects. The studied test cases involve conventional Printed Circuit Board Assemblies (PCBAs) with open sockets and Ball Grid Array (BGA) packages.